Development History

2024 — Released 0.8mm ultra-fine pitch series for next-gen 5G modules.
2022 — IATF 16949 certification covering automotive product lines.
2020 — Expanded SMT line capacity to 80M units / month.
2018 — First export contracts in Southeast Asia and Europe.
2015 — Founded in Shenzhen with focus on board-to-board connectors.