Signal Integrity
Backplane interconnects must preserve signal quality for high-speed protocols. Our 1.27mm Female Headers feature low-crosstalk pin-geometry and controlled-impedance options for differential pairs.
Communications & Servers
High-Density Headers for Telecom & Server
Telecom line-cards and server mid-planes rely on dense, signal-integrity-grade connectors. Our fine-pitch Female Headers (1.27mm and 2.54mm, single/dual/triple row) provide reliable mid-plane and daughter-card mating. Combined with high-Tg LCP housings, they withstand multi-cycle IR reflow and extended thermal soak.
Industry Challenges We Solve
Pin Density
Multi-row, fine-pitch female headers (1.27mm dual/triple row) maximize per-slot bandwidth for telecom line-cards and compute blades.
Thermal Endurance
LCP and high-Tg housings rated for IR reflow and long thermal soak ensure no plastic deformation during assembly and in sustained high-ambient data-center operation.
Ready to Specify Your Connector?
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Request a QuoteTypical Applications
Telecom Line Cards
Server Mid-Plane Boards
Network Switch Modules
Optical Transceiver Sockets
Data Center Power Distribution